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Solidstate Components, located in Santa Fe Springs, CA, specializes in advanced semiconductor packaging solutions, offering a variety of services, including molded interconnect systems, complete turnkey assembly, and comprehensive testing services. Their global presence spans multiple factory locations in Malaysia, China, and Indonesia, enabling them to efficiently meet the needs of complex design projects. With a commitment to quality and innovation, Solidstate Components provides wafer bumping services and utilizes over 100 variations of bumping options via its subsidiary, Unisem Advanced Technologies. Their facility in Chengdu, China, serves as a state-of-the-art hub for semiconductor assembly and testing, enhancing the company's capability to deliver high-quality products worldwide. Generated from the website