Bingham Mechanical Inc.

Besi is a leading provider of assembly processes and equipment for packaging applications in various industries, including electronics, automotive, and solar energy. They develop cutting-edge technologies for leadframe, substrate, and wafer level packaging, catering to the needs of diverse end-user markets. With a focus on innovation and advanced manufacturing techniques, Besi offers a wide range of products and services, including die bonding, flip chip, molding, plating, and cleaning solutions. Their commitment to quality and customer satisfaction has made them a trusted name in the semiconductor equipment industry.Generated from the website